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ICMESP 2021: International Conference on Microelectronic Engineering and Semiconductor Physics
- 会议时间:2021-01-07 至 2021-01-08
- 会议地点: ,Tokyo,Japan 周边酒店预订
- 主办单位: WASET - World Academy of Science, Engineering and Technology
发票类型:
不支持开票
参会凭证:其它
ICMESP 2021: International Conference on Microelectronic Engineering and Semiconductor Physics covers topics such as:
- Semiconductors for microelectronics and photonics
- Microelectronics, electromagnetics and photonics
- Microelectronics, photonics and nanotechnology
- Microelectronics and photonics
- Engineered materials
- Photonics, micro-electronics, and materials
- Microelectronics
- Micro- and nanotechnology
- Photonics
- Microelectronics
- Micro-/nano-engineering / fabrication / technology / manufacturing
- Microelectronics processing and materials
- Microsystems, microdevices (e.g., sensors and nanoenergy devices) and their fabrication
- Nanoelectronic and photonic devices and their fabrication
- Nanolithography and nanopatterning
- Microfluidics, life science devices /sensors, as well as integrated lab-on-a-chip and their fabrication
- Electron optical methods and systems
- Optical lithography
- Resists
- X-ray optical methods and systems
- Nanoimprint lithography
- Limits of nanolithography
- Charged particle based lithography and patterning
- Euv lithography and masks
- Maskless lithography
- Nanoimprint lithography techniques and templates
- Limits of nanopatterning
- Emerging nanopatterning methods
- Ion technology
- Pattern transfer
- Transfer of pattern with other methods
- Plasma processing
- Plasma nanotechnology
- Plasma etching
- Plasma surface modification of devices
- Plasma / beam nanopatterning
- Materials
- Wet transfer methods
- Silicon on insulators
- Metallization and barrier materials
- Interconnects
- Dielectrics (low k and high k)
- Nanomaterials for device fabrication
- New resist materials
- Polymers and flexible substrates
- Block copolymers
- Nanometrology, inspection and testing
- Layered (2d) materials and related transferring techniques
- Laser probes
- Electron beam testers
- Nanometrology
- Signal and image processing
- Advanced processing and nanofabrication
- Afm and scanning probe measurements
- Three dimensional integration
- Process integration
- 3d printing
- Other / emerging manufacturing and fabrication techniques
- Process modelling and simulation
- Rapid thermal processing
- Laser assisted processing
- Equipment modelling
- Growth, planarization, cleaning techniques for devices
- Top-down / bottom-up (self-assembly) nanofabrication
- Mbe
- Plasma deposition
- Planarization and cleaning techniques
- Other growth techniques
- Nanoelectronic, optoelectronic and photonic devices
- Advanced nanoelectronic, photonic, sensing, energy harvesting, and fluidic devices
- Steep slope or fast switching devices
- Memristive devices for neuromorphic computing
- Optoelectronic devices
- Photonic devices
- Memory devices
- Dimension-sensitive device properties
- Advanced mos devices
- Magnetic and spintronic devices
- Flexible / organic / molecular electronics
- Vacuum nanoelectronics
- Flexible electronics
- Organic and molecular electronics
- Paper electronics
- Wearable electronics
- Microdevices, energy harvesting devices and sensors
- Printed electronics
- Energy harvesting devices
- Physical sensors and actuators
- Valving devices
- Micro- and nanofluidics
- Mixing devices
- Pumping devices
- Biosensors
- Chemical sensors
- Bioelectronic devices
- Biomimetic properties incorporated into devices
- Advanced fabrication and characterization for heterogeneous micro and nano systems
- Micro / nano / bio interface and interconnection devices
- Power mems
- Electro-mechanical systems (mems, nems)
- Moems
- Rf mems
- Optical and photonic systems
- Magnetic mems
- Pumping / valving systems
- Fluidic systems
- Fluidic interfaces and integration
- Microreactors
- Dna / protein chips
- Biosystems
- Organ on chip
- Cell on chip
- Lab-on-a-chip
- Biomimetic properties incorporated into systems
- Microseparation, pretreatment systems
- Bioanalytic, diagnostic systems
- Environmental and food monitoring systems
- On-chip detection systems
- Research and advances in nanoelectronics, nanofabrication, micro-nano systems, and applications
- Separation devices
- Other miniaturized devices for biology, chemistry, and medicine (sensors and biosensors)
ICMESP 2021: International Conference on Microelectronic Engineering and Semiconductor Physics will be held in Tokyo, Japan on 07-08 Jan 2021.
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