ICMMI 2021: 15. International Conference on Materials Modelling and Interoperability
- 会议时间：2021-04-08 至 2021-04-09
- 会议地点： Athens, Greece,Barcelona,Spain 周边酒店预订
发票类型：
不支持开票
参会凭证：其它
| Participation Type | Early Registration Fees | Registration Fees |
|---|---|---|
| Non-Student Oral/Poster Presenter Registration | € 350 | € 400 |
| Student Oral/Poster Presenter Registration | € 300 | € 350 |
| Listener Registration | € 250 | € 300 |
| Additional Paper Publication | € 100 | |
The International Research Conference Aims and Objectives
The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations. With its high quality, it provides an exceptional value for students, academics and industry researchers.
ICMMI 2021: 15. International Conference on Materials Modelling and Interoperability aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Materials Modelling and Interoperability. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Materials Modelling and Interoperability
Call for Contributions
Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Materials Modelling and Interoperability are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.
Guidelines for Authors
Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers. Downloadable versions of the check list for Full-Text Papers and Abstract Papers.
Please refer to the Paper Submission Guideline, Abstract Submission Guideline and Author Information before submitting your paper.
Conference Proceedings
All submitted conference papers will be blind peer reviewed by three competent reviewers. The peer-reviewed conference proceedings are indexed in the Open Science Index, Google Scholar, Semantic Scholar, Zenedo, OpenAIRE, BASE, WorldCAT, Sherpa/RoMEO, and other index databases. Impact Factor Indicators.
Special Journal Issues
ICMMI 2021 has teamed up with the Special Journal Issue on Materials Modelling and Interoperability. A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete the Conference Sponsorship Request Form.
Application Forms
Selected Papers
- Implementation of a Serializer to Represent PHP Objects in the Extensible Markup Language
Lidia N. Hernández-Piña, Carlos R. Jaimez-González - Introduction of an Approach of Complex Virtual Devices to Achieve Device Interoperability in Smart Building Systems
Thomas Meier - Analysis of Threats in Interoperability of Medical Devices
M. Sandhya, R. M. Madhumitha, Sharmila Sankar - Integrated Design in Additive Manufacturing Based on Design for Manufacturing
E. Asadollahi-Yazdi, J. Gardan, P. Lafon - A State-Of-The-Art Review on Web Services Adaptation
M. Velasco, D. While, P. Raju, J. Krasniewicz, A. Amini, L. Hernandez-Munoz - ConductHome: Gesture Interface Control of Home Automation Boxes
J. Branstett, V. Gagneux, A. Leleu, B. Levadoux, J. Pascale - Electronic Health Record System: A Perspective to Improve the Value of Services Rendered to Patients in Healthcare Organization in Rwanda, Case of CHUB and Hopital De Nemba
Mugabe Nzarama Gabriel - Steps towards the Development of National Health Data Standards in Developing Countries: An Exploratory Qualitative Study in Saudi Arabia
Abdullah I. Alkraiji, Thomas W. Jackson, Ian R. Murray - The Use of Crisis Workplace Technology to Protect Communication Processes of Critical Infrastructure
Jiri Barta, Jiri F. Urbanek - Flexible Communication Platform for Crisis Management
Jiří Barta, Tomáš Ludík, Jiří Urbánek - Scientific Workflow Interoperability Evaluation
Ahmed Alqaoud - Spatial Services in Cloud Environment
Sašo Pečnik, Borut Žalik - Analysis and Design of Security Oriented Communication System
Jiří Barta - Personalization and the Universal Communications Identifier Concept
Françoise Petersen, Mike Pluke, Tatiana Kovacikova, Giovanni Bartolomeo - Defining Programming Problems as Learning Objects
José Paulo Leal, Ricardo Queirós
| Huachun Zhai | Idaho Asphalt Supply, US |
| Hamid Torabi | Washington State University, US |
| Vivek Sharma | Intel Corporation, US |
| Jing-jiang Yu | Agilent Technologies, Inc., US |
| Cecil Coutinho | University of South Florida, US |
| Shankar Krishnan | Wentworth Institute of Technology, US |
| Ghanshyam Barman | Uka Tarsadia University, IN |
| Edwin Tonderai Mombeshora | University of KwaZulu-Natal, ZA |
| Marios Kazasidis | Trinity College Dublin, IE |
| Shurooq Al-Badri | University of Baghdad, IQ |
| Tamer Ezzat Youssef | Imam Abdulrhaman Bin Faisal University, SA |
| Mallikarjuna Reddy Kesama | Sungkyunkwan University, KR |
| Victor Manuel Perez Puyana | University of Seville, ES |
| Donatella Giuranno | National Research Council (Italy), IT |
| Y S Reddy | Chaitanya Bharathi Institute of Technology, IN |
| Bandar Almangour | Saudi Basic Industries Corporation (SABIC), SA |
| Venugopal Reddy Paduru Paduru | Osmania University, IN |
| Bhupinder Kaur | Akal Degree College , IN |
| Newaz Mohammed Bahadur | Noakhali Science and Technology University, BD |
| Madhuri Kalapala | VFSTRU, IN |
| Jose Alberto Duarte Moller | La Salle University of Bajío, MX |
| Heba Al-Kelesh | Central Metallurgical Research and Development Institute, EG |
| Reza Miresmaeili | Tarbiat Modares University, IR |
| Yasser Gaber | Beni-Suef university, EG |
| Anuj Kumar | Jaypee Institute of Information Technology, IN |
| Divakar Canchi | National Aerospace Laboratories, IN |
| Venkata Ranganayakulu Segu | Guru Nanak Institutions Technical Campus, IN |
| Mitsuhiro Okayasu | Okayama University, JP |
| Marcela Elisabeta Barbinta-Patrascu | University of Bucharest, RO |
| Laxman Survase | Shri SH Kelkar College of Arts Commerce and Science, IN |
| Abstracts/Full-Text Paper Submission Deadline | January 06, 2020 | |
| Notification of Acceptance/Rejection | January 28, 2020 | |
| Final Paper (Camera Ready) Submission & Early Bird Registration Deadline | March 08, 2021 | |
| Conference Dates | April 08-09, 2021 |
