您好,欢迎登录Mr.confs会先生官方网站!

ICREEP 2021: 15. International Conference on Remanufacturing Engineering and Electronic Packaging

时间:2021-10-06 至 2021-10-07

ICREEP 2021: 15. International Conference on Remanufacturing Engineering and Electronic Packaging
收藏0
ICREEP 2021: 15. International Conference on Remanufacturing Engineering and Electronic Packaging
会议时间:2021-10-06 至 2021-10-07
会议地点: Beijing, China,Beijing,China 周边酒店预订

发票类型: 不支持开票
参会凭证:其它

门票信息
Participation Type Early Registration Fees Registration Fees
Non-Student Oral/Poster Presenter Registration € 350 € 400
Student Oral/Poster Presenter Registration € 300 € 350
Listener Registration € 250 € 300
Additional Paper Publication € 100
会议介绍

The International Research Conference Aims and Objectives

The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations. With its high quality, it provides an exceptional value for students, academics and industry researchers.

ICREEP 2021: 15. International Conference on Remanufacturing Engineering and Electronic Packaging aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Remanufacturing Engineering and Electronic Packaging. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Remanufacturing Engineering and Electronic Packaging

Call for Contributions

Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Remanufacturing Engineering and Electronic Packaging are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.

Guidelines for Authors

Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers. Downloadable versions of the check list for Full-Text Papers and Abstract Papers.

Please refer to the Paper Submission Guideline, Abstract Submission Guideline and Author Information before submitting your paper.

Conference Proceedings

All submitted conference papers will be blind peer reviewed by three competent reviewers. The peer-reviewed conference proceedings are indexed in the Open Science Index, Google Scholar, Semantic Scholar, Zenedo, OpenAIRE, BASE, WorldCAT, Sherpa/RoMEO, and other index databases. Impact Factor Indicators.

Special Journal Issues

ICREEP 2021 has teamed up with the Special Journal Issue on Remanufacturing Engineering and Electronic Packaging. A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.

Conference Sponsor and Exhibitor Opportunities

The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete the Conference Sponsorship Request Form.

Selected Papers

  1. Pictorial Multimodal Analysis of Selected Paintings of Salvador Dali
    Shaza Melies, Abeer Refky, Nihad Mansoor
  2. Protection of Cultural Heritage against the Effects of Climate Change Using Autonomous Aerial Systems Combined with Automated Decision Support
    Artur Krukowski, Emmanouela Vogiatzaki
  3. Words of Peace in the Speeches of the Egyptian President, Abdulfattah El-Sisi: A Corpus-Based Study
    Mohamed S. Negm, Waleed S. Mandour
  4. Accessibility and Visibility through Space Syntax Analysis of the Linga Raj Temple in Odisha, India
    S. Pramanik
  5. Training Undergraduate Engineering Students in Robotics and Automation through Model-Based Design Training: A Case Study at Assumption University of Thailand
    Sajed A. Habib
  6. Modelling and Control of Milk Fermentation Process in Biochemical Reactor
    Jožef Ritonja
  7. Human Factors Considerations in New Generation Fighter Planes to Enhance Combat Effectiveness
    Chitra Rajagopal, Indra Deo Kumar, Ruchi Joshi, Binoy Bhargavan
  8. Evaluation of Underground Water Flow into Tabriz Metro Tunnel First Line by Hydro-Mechanical Coupling Analysis
    L. Nikakhtar, S. Zare
  9. Supporting Densification through the Planning and Implementation of Road Infrastructure in the South African Context
    K. Govender, M. Sinclair
  10. Lexicon-Based Sentiment Analysis for Stock Movement Prediction
    Zane Turner, Kevin Labille, Susan Gauch
  11. An Open Loop Distribution Module for Precise and Uniform Drip Fertigation in Soilless Culture
    Juan Ignacio Arango, Andres Diaz, Giacomo Barbieri
  12. Influence of Selected Finishing Technologies on the Roughness Parameters of Stainless Steel Manufactured by Selective Laser Melting Method
    J. Hajnys, M. Pagac, J. Petru, P. Stefek, J. Mesicek, J. Kratochvil
  13. The Truth about Good and Evil: A Mixed-Methods Approach to Color Theory
    Raniya Alsharif
  14. User Requirements Analysis for the Development of Assistive Navigation Mobile Apps for Blind and Visually Impaired People
    Paraskevi Theodorou, Apostolos Meliones
  15. Kinetic Parameter Estimation from Thermogravimetry and Microscale Combustion Calorimetry
    Rhoda Afriyie Mensah, Lin Jiang, Solomon Asante-Okyere, Xu Qiang, Cong Jin
E. Prince Edward Sri Krishna Polytechnic College, IN
Branka Marasovic Faculty of Economics, University of Split, Croatia
Rozlan Alias Tun Hussein Onn University of Malaysia, MY
K. Sivakumar Krishnamoorthy Sri Chandrasekharendra Saraswathi Viswa Mahavidyalaya University, IN
Silu Liu Southwest Jiaotong University, CN
Rhoda Afriyie Mensah Nanjing University of Science and Technology, CN
Kun Li Beijing Normal University, CN
Huasong Shan Louisiana State University, CN
Zeeshan Jamil INEST CAS China, USTC China, CN
Hayat Bedru Dalian University of Technology, CN
Muhammad Ahmad Peking University, CN
A.B.M. Munibur Rahman Wuhan University of Technology, CN
Nasseer Bachache Huazhong University of Science and Technology , CN
Xiaojun Liu Shihezi University, CN
Dong Zhang Beijing Jiaotong University, CN
Jingying Wang Shanghai Institute of Technical Physics of Chinese Academy of Sciences, CN
Zhixiang Chen Sun Yat-sen University, CN
XU ZHANG Harbin Engineering University, CN
hengbin wu chongqing three gorges university, CN
Ping Dong Hunan University, CN
Xiaochuan Chen Donghua University, CN
Chansheng He Lanzhou University , CN
Liang Wang Northwesern Polytechnical University, CN
Berlinyu Berlin University of Electronic Science and Technology of China, CN
Xiaoming Yao Hainan University, CN
Jingtao Zhou Northwestern Polytechnical University, CN
Qi Wang Wenzhou University, CN
Bainian Li Anhui University of Finance and Economics, CN
Yi Cao Henan University of Technology, CN
NING XU Wuhan University of Technology, CN
会议日程
Abstracts/Full-Text Paper Submission Deadline   January 28, 2021
Notification of Acceptance/Rejection   February 11, 2021
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline   September 06, 2021
Conference Dates   October 06-07, 2021
参会指南
您可能还会关注
会议地点
×