ICEPAE 2021: 15. International Conference on Electronic Packaging and Adhesives in Electronics
- 会议时间：2021-04-19 至 2021-04-20
- 会议地点： Paris, France,Paris,France 周边酒店预订
发票类型：
不支持开票
参会凭证：其它
| Participation Type | Early Registration Ticket Fees | Registration Ticket Fees |
|---|---|---|
| Non-Student Oral/Poster Presenter Registration | € 450 | € 500 |
| Student Oral/Poster Presenter Registration | € 350 | € 400 |
| Listener Registration | € 250 | € 300 |
| Additional Paper Publication | € 100 | |
The International Research Conference Aims and Objectives
The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations. With its high quality, it provides an exceptional value for students, academics and industry researchers.
ICEPAE 2021: 15. International Conference on Electronic Packaging and Adhesives in Electronics aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Electronic Packaging and Adhesives in Electronics. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Electronic Packaging and Adhesives in Electronics
Call for Contributions
Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Electronic Packaging and Adhesives in Electronics are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.
Guidelines for Authors
Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers. Downloadable versions of the check list for Full-Text Papers and Abstract Papers.
Please refer to the Paper Submission Guideline, Abstract Submission Guideline and Author Information before submitting your paper.
Conference Proceedings
All submitted conference papers will be blind peer reviewed by three competent reviewers. The peer-reviewed conference proceedings are indexed in the Open Science Index, Google Scholar, Semantic Scholar, Zenedo, OpenAIRE, BASE, WorldCAT, Sherpa/RoMEO, and other index databases. Impact Factor Indicators.
Special Journal Issues
ICEPAE 2021 has teamed up with the Special Journal Issue on Electronic Packaging and Adhesives in Electronics. A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete the Conference Sponsorship Request Form.
Application Forms
Selected Papers
- Fully Printed Strain Gauges: A Comparison of Aerosoljet-Printing and Micropipette-Dispensing
Benjamin Panreck, Manfred Hild - Fabrication of Wearable Antennas through Thermal Deposition
Jeff Letcher, Dennis Tierney, Haider Raad - Generic Data Warehousing for Consumer Electronics Retail Industry
S. Habte, K. Ouazzane, P. Patel, S. Patel - A Compact Wearable Slot Antenna for LTE and WLAN Applications
Haider K. Raad - Dynamic Modelling and Virtual Simulation of Digital Duty-Cycle Modulation Control Drivers
J. Mbihi - Evaluation of the Elastic Mechanical Properties of a Hybrid Adhesive Material
Moudar H. A. Zgoul, Amin Al Zamer - Localized and Time-Resolved Velocity Measurements of Pulsatile Flow in a Rectangular Channel
R. Blythman, N. Jeffers, T. Persoons, D. B. Murray - A Fault-Tolerant Full Adder in Double Pass CMOS Transistor
Abdelmonaem Ayachi, Belgacem Hamdi - A Novel Approach to Asynchronous State Machine Modeling on Multisim for Avoiding Function Hazards
L. Parisi, D. Hamili, N. Azlan - Review, Analysis and Simulation of Advanced Technology Solutions of Selected Components in Power Electronics Systems (PES) of More Electric Aircraft
Lucjan Setlak, Emil Ruda - The Effect of CPU Location in Total Immersion of Microelectronics
A. Almaneea, N. Kapur, J. L. Summers, H. M. Thompson - Design and Control Algorithms for Power Electronic Converters for EV Applications
Ilya Kavalchuk, Mehdi Seyedmahmoudian, Ben Horan, Aman Than Oo, Alex Stojcevski - DNA Nanowires: A Charge Transfer Approach
S. Behnia, S. Fathizadeh - An Analytical Comparison between Open Loop, PID and Fuzzy Logic Based DC-DC Boost Convertor
Muhammad Mujtaba Asad, Razali Bin Hassan, Fahad Sherwani - Interfacing and Replication of Electronic Machinery Using MATLAB / SIMULINK
Abdulatif Abdusalam, Mohamed Shaban
| Rajiv Dutta | Shobhit University, IN |
| Bharatiraja Chokkalingam | SRM Institute of Science and Technology, IN |
| CHIROUF FARID | University of Caen, FR |
| Gang YANG | SUPELEC, FR |
| Ezendu Ariwa | University of Bedfordshire, UK |
| Mohammad Al - Amri | University of Surrey, UK |
| Ka Sing Lim | University of Liverpool, UK |
| Dezhi Li | University of Warwick, UK |
| M. Ashraf Khan | Saginaw Valley State University, US |
| Mohammad Khatibi | University of Texas at San Antonio, US |
| Pragya Kushwaha | University of California Berkeley USA, US |
| Kartik Iyer | University of Minnesota, US |
| Florian Misoc | Kennesaw State University, US |
| Mohammad Reza Zamani Kouhpanji | University of Minnesota Twin Cities, US |
| Vibhash Jha | NXP Semiconductors, US |
| Albert Alexander Stonier | Northeastern University, US |
| Ehsan Kamrani | Harvard University, US |
| Florian Misoc | Kennesaw State University, US |
| Vardhini Catari Catari | Taylor Business Institute, US |
| MUHAMMAD RASHID | UNIVERSITY OF WEST FLORIDA, US |
| Naga Srinivas Korivi | Louisiana State University, US |
| Ashok Goel | Michigan Technological University, US |
| Jiahui Yuan | Georgia Institute of Technology, US |
| Wei Wu | Northwestern University, US |
| Md. Shoaibur Rahman Shoaib | Baylor College of Medicine, US |
| Adel El Shahat | Ohio State University, US |
| Lili He | San Jose State University, US |
| Chethan Parameswariah | New Mexico Tech, US |
| Anu Gokhale | Illinois State University, US |
| Joseph Prabhakar Williams | Sri Indu College of Engineering and Technology, IN |
| Abstracts/Full-Text Paper Submission Deadline | March 01, 2021 | |
| Notification of Acceptance/Rejection | March 15, 2021 | |
| Final Paper (Camera Ready) Submission & Early Bird Registration Deadline | March 18, 2021 | |
| Conference Dates | April 19-20, 2021 |
-
ICEPT 2021: 15. International Conference on Ethnopharmacology and Pharmaceuticals Testing
-
ICNETH 2021: 15. International Conference on Nuclear Engineering and Thermal Hydraulics
-
ICWH 2021: 15. International Conference on Women Healthcare
-
ICHDMFI 2021: 15. International Conference on Health Data Mining and Feedback Integration
