
ICTTD 2021: 15. International Conference on Thermophysics and Thermal Design
- 会议时间:2021-02-22 至 2021-02-23
- 会议地点: Paris, France,Paris,France 周边酒店预订
发票类型:
不支持开票
参会凭证:其它
Participation Type | Early Registration Fees | Registration Fees |
---|---|---|
Non-Student Oral/Poster Presenter Registration | € 450 | € 500 |
Student Oral/Poster Presenter Registration | € 350 | € 400 |
Listener Registration | € 250 | € 300 |
Additional Paper Publication | € 100 |
The International Research Conference Aims and Objectives
The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations. With its high quality, it provides an exceptional value for students, academics and industry researchers.
ICTTD 2021: 15. International Conference on Thermophysics and Thermal Design aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Thermophysics and Thermal Design. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Thermophysics and Thermal Design
Call for Contributions
Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Thermophysics and Thermal Design are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.
Guidelines for Authors
Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers. Downloadable versions of the check list for Full-Text Papers and Abstract Papers.
Please refer to the Paper Submission Guideline, Abstract Submission Guideline and Author Information before submitting your paper.
Conference Proceedings
All submitted conference papers will be blind peer reviewed by three competent reviewers. The peer-reviewed conference proceedings are indexed in the Open Science Index, Google Scholar, Semantic Scholar, Zenedo, OpenAIRE, BASE, WorldCAT, Sherpa/RoMEO, and other index databases. Impact Factor Indicators.
Special Journal Issues
ICTTD 2021 has teamed up with the Special Journal Issue on Thermophysics and Thermal Design. A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete the Conference Sponsorship Request Form.
Application Forms
Selected Papers
- Lattice Boltzmann Simulation of MHD Natural Convection Heat Transfer of Cu-Water Nanofluid in a Linearly/Sinusoidally Heated Cavity
Bouchmel Mliki, Chaouki Ali, Mohamed Ammar Abbassi - Experimental Investigation the Effectiveness of Using Heat Pipe on the Spacecraft Mockup Panel
M. Abdou, M. K. Khalil - Radiation Effects on the Unsteady MHD Free Convection Flow Past in an Infinite Vertical Plate with Heat Source
Tusharkanta Das, Tumbanath Samantara, Sukanta Kumar Sahoo - Heat and Mass Transfer Modelling of Industrial Sludge Drying at Different Pressures and Temperatures
L. Al Ahmad, C. Latrille, D. Hainos, D. Blanc, M. Clausse - Thermal Analysis of Circular Pin-fin with Rectangular Slot at the Center by Forced Convection
Kavita H. Dhanawade, Hanamant S. Dhanawade, Ajay Kashikar, Shweta Matey, Mahesh Bhadane, Sunny Sarraf - Effect of Two Radial Fins on Heat Transfer and Flow Structure in a Horizontal Annulus
Anas El Amraoui, Abdelkhalek Cheddadi, Mohammed Touhami Ouazzani - Multilayer Thermal Screens for Greenhouse Insulation
Clara Shenderey, Helena Vitoshkin, Mordechai Barak, Avraham Arbel - Modeling the Effect of Scale Deposition on Heat Transfer in Desalination Multi-Effect Distillation Evaporators
K. Bourouni, M. Chacha, T. Jaber, A. Tchantchane - Mixed Convection Heat Transfer of Copper Oxide-Heat Transfer Oil Nanofluid in Vertical Tube
Farhad Hekmatipour, M. A. Akhavan-Behabadi, Farzad Hekmatipour - Experimental Investigation of Heat Pipe with Annular Fins under Natural Convection at Different Inclinations
Gangacharyulu Dasaroju, Sumeet Sharma, Sanjay Singh - Three-Dimensional Generalized Thermoelasticity with Variable Thermal Conductivity
Hamdy M. Youssef, Mowffaq Oreijah, Hunaydi S. Alsharif - Hydrodynamic Analysis with Heat Transfer in Solid Gas Fluidized Bed Reactor for Solar Thermal Applications
Sam Rasoulzadeh, Atefeh Mousavi - Determination of the Thermophysical Characteristics of the Composite Material Clay Cement Paper
A. Ouargui, N. Belouaggadia, M. Ezzine - Compressible Flow Modeling in Pipes and Porous Media during Blowdown Experiment
Thomas Paris, Vincent Bruyere, Patrick Namy - Mixed Convection Enhancement in a 3D Lid-Driven Cavity Containing a Rotating Cylinder by Applying an Artificial Roughness
Ali Khaleel Kareem, Shian Gao, Ahmed Qasim Ahmed
Sebastien Poncet | Aix-Marseille University, FR |
Konstantin Volkov | Kingston University, UK |
Ahmed Abou El - Azm Aly | The University of Sheffield, UK |
Bo Jin | Air Products, US |
Imane Khalil | University of San Diego, US |
Behrouz Takabi | Texas A&M University, US |
Chiranth Srinivasan | University of Oklahoma, US |
Afshin Ghajar | Oklahoma State University, US |
Xin Gu | Exa Corporation, US |
Costel Constantin | James Madison University, US |
David Sundin | Ambit Technical Consulting, Inc., US |
Vivek Sharma | Intel Corporation, US |
David Sawyers | Ohio Northern University, US |
Feng Lai | University of Oklahoma, US |
Hua Tan | Hewlett - Packard Company, US |
Guoxiang Liu | University of North Dakota, US |
Hanfei Tuo | University of Illinois Urbana Champaign, US |
Cecil Coutinho | University of South Florida, US |
Nigil Satish Jeyashekar | Southwest Research Institute, US |
Ryo Amano | University of Wisconsin, US |
Ramesh AGARWAL | Washington University in St. Louis, US |
Zafer Baskaya | Istanbul Technical University, TR |
Tarek Emam | Ain Shams University, EG |
M N Khan | Majmaah University, SA |
Ammar Abdulkadhim | University of Babylon, IQ |
Ann Lee | Macquarie University, AU |
Viswanatha Sharma Korada | Jawaharlal Nehru Technological University Hyderabad, IN |
Emmanuel Sangotayo | Ladoke Akintola University of Technology, Ogbomoso, NG |
Wisam Hussam | Australian College of Kuwait, KW |
Sameena Tarannum | CHRIST (Deemed to be University), IN |
Abstracts/Full-Text Paper Submission Deadline | January 06, 2020 | |
Notification of Acceptance/Rejection | January 28, 2020 | |
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline | January 21, 2021 | |
Conference Dates | February 22-23, 2021 |
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