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ICEMPA 2021: 15. International Conference on Electromagnetic Material Processing Applications

时间:2021-04-08 至 2021-04-09

ICEMPA 2021: 15. International Conference on Electromagnetic Material Processing Applications
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ICEMPA 2021: 15. International Conference on Electromagnetic Material Processing Applications
会议时间:2021-04-08 至 2021-04-09
会议地点: Athens, Greece,Athens,Greece 周边酒店预订

发票类型: 不支持开票
参会凭证:其它

门票信息
Participation Type Early Registration Fees Registration Fees
Non-Student Oral/Poster Presenter Registration € 350 € 400
Student Oral/Poster Presenter Registration € 300 € 350
Listener Registration € 250 € 300
Additional Paper Publication € 100
会议介绍

The International Research Conference Aims and Objectives

The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations. With its high quality, it provides an exceptional value for students, academics and industry researchers.

ICEMPA 2021: 15. International Conference on Electromagnetic Material Processing Applications aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Electromagnetic Material Processing Applications. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Electromagnetic Material Processing Applications

Call for Contributions

Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Electromagnetic Material Processing Applications are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.

Guidelines for Authors

Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers. Downloadable versions of the check list for Full-Text Papers and Abstract Papers.

Please refer to the Paper Submission Guideline, Abstract Submission Guideline and Author Information before submitting your paper.

Conference Proceedings

All submitted conference papers will be blind peer reviewed by three competent reviewers. The peer-reviewed conference proceedings are indexed in the Open Science Index, Google Scholar, Semantic Scholar, Zenedo, OpenAIRE, BASE, WorldCAT, Sherpa/RoMEO, and other index databases. Impact Factor Indicators.

Special Journal Issues

ICEMPA 2021 has teamed up with the Special Journal Issue on Electromagnetic Material Processing Applications. A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.

Conference Sponsor and Exhibitor Opportunities

The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete the Conference Sponsorship Request Form.

Selected Papers

  1. A Study on the Effect of Mg and Ag Additions and Age Hardening Treatment on the Properties of As-Cast Al-Cu-Mg-Ag Alloys
    Ahmed. S. Alasmari, M. S. Soliman, Magdy M. El-Rayes
  2. Production of Spherical Cementite within Bainitic Matrix Microstructures in High Carbon Powder Metallurgy Steels
    O. Altuntaş, A. Güral
  3. Effect of Heat Treatment on Mechanical Properties and Wear Behavior of Al7075 Alloy Reinforced with Beryl and Graphene Hybrid Metal Matrix Composites
    Shanawaz Patil, Mohamed Haneef, K. S. Narayanaswamy
  4. Morphological and Electrical Characterization of Polyacrylonitrile Nanofibers Synthesized Using Electrospinning Method for Electrical Application
    Divyanka Sontakke, Arpit Thakre, D. K Shinde, Sujata Parmeshwaran
  5. Experimental Investigation on Effect of Different Heat Treatments on Phase Transformation and Superelasticity of NiTi Alloy
    Erfan Asghari Fesaghandis, Reza Ghaffari Adli, Abbas Kianvash, Hossein Aghajani, Homa Homaie
  6. Experimental and Simulation Stress Strain Comparison of Hot Single Point Incremental Forming
    Amar Al-Obaidi, Verena Kräusel, Dirk Landgrebe
  7. Influence of Sodium Acetate on Electroless Ni-P Deposits and Effect of Heat Treatment on Corrosion Behavior
    Y. El Kaissi, M. Allam, A. Koulou, M. Galai, M. Ebn Touhami
  8. Microstructure and Mechanical Properties of Mg-Zn Alloys
    Young Sik Kim, Tae Kwon Ha
  9. Cold Spray Deposition of SS316L Powders on Al5052 Substrates and Their Potential Using for Biomedical Applications
    B. Dikici, I. Ozdemir, M. Topuz
  10. Cyclic Heating Effect on Hardness of Copper
    Tahany W. Sadak
  11. Effect of Alloying Elements and Hot Forging/Rolling Reduction Ratio on Hardness and Impact Toughness of Heat Treated Low Alloy Steels
    Mahmoud M. Tash
  12. Effect of T6 and Re-Aging Heat Treatment on Mechanical Properties of 7055 Aluminum Alloy
    M. Esmailian, M. Shakouri, A. Mottahedi, S. G. Shabestari
  13. Separation of Hazardous Brominated Plastics from Waste Plastics by Froth Flotation after Surface Modification with Mild Heat-Treatment
    Nguyen Thi Thanh Truc, Chi-Hyeon Lee, Byeong-Kyu Lee, Srinivasa Reddy Mallampati
  14. Induction Heating Process Design Using Comsol® Multiphysics Software Version 4.2a
    K. Djellabi, M. E. H. Latreche
  15. Influence of Post Weld Heat Treatment on Mechanical and Metallurgical Properties of TIG Welded Aluminium Alloy Joints
    Gurmeet Singh Cheema, Navjotinder Singh, Gurjinder Singh, Amardeep Singh Kang
Chi-Wai Chan Queen's University Belfast, UK
Reeshemah Burrell The National Science Foundation (NSF), US
Hemant Borkar IIT Indore, IN
Olawale Samuel Fatoba University of Johannesburg, ZA
Maha El-Meligy Central Metallurgical R&D Institute (CMRDI), EG
Yuvraj Malghe The Institute of Science , IN
Nitish Bibhanshu Indian Institute of Science, IN
Sumit Ghosh Indian Institute of Technology Roorkee, IN
Segun Isaac Talabi UNIVERSITY OF ILORIN, NG
Mohammad Esmailian Iranian Research Organization for Science and Technology(IROST), Iran, Islamic Republic Of
Zdeněk Veselý New Technologies Research Centre, University of West Bohemia, Czech Republic
Achutha Kini U MIT/Manipal University, India
Burak Dikici Yuzuncu Yil University, Turkey
Sirikul Wisutmethangoon Prince of Songkla University, Thailand
Djellabi Karima University of Constantine, Algeria
Noura Dahbi Bechar University, DZ
Benachour Mustapha University of Tlemcen, Algeria
My Ali El Khakani University of Quebec, CA
Rabi Behrooz Tarbiat Modares University, IR
Sathya Shankar Sharma MIT/Manipal University, IN
Chin Seong Lim University of Nottingham Malaysia, MY
Dakshinamoorthy Sathiyamoorthy Institut Teknologi Brunei, BN
Mohamed Gebril Benghazi University, LY
Nancy Julius Siambun Universiti Malaysia Sabah, MY
Khalil Al-Hatab Sanaa University, YE
L. Karthikeyan Panimalar Engineering College, IN
Avanish Kumar Dubey Motilal Nehru National Institute of Technology Allahabad, IN
CHETANYA PRAKASH SHARMA Malaviya National Institute of Technology Jaipur, IN
Tajudeen Kolawole AJIBOYE University of Ilorin, NG
Mahadzir Ishak Universiti Malaysia Pahang, MY
会议日程
Abstracts/Full-Text Paper Submission Deadline   January 06, 2020
Notification of Acceptance/Rejection   January 28, 2020
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline   March 08, 2021
Conference Dates   April 08-09, 2021
参会指南
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