ICSM 2021: 15. International Conference on Sensor Materials
- 会议时间：2021-04-22 至 2021-04-23
- 会议地点： Tokyo, Japan,Tokyo,Japan 周边酒店预订
发票类型：
不支持开票
参会凭证：其它
| Participation Type | Early Registration Fees | Registration Fees |
|---|---|---|
| Non-Student Oral/Poster Presenter Registration | € 450 | € 500 |
| Student Oral/Poster Presenter Registration | € 350 | € 400 |
| Listener Registration | € 250 | € 300 |
| Additional Paper Publication | € 100 | |
The International Research Conference Aims and Objectives
The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations. With its high quality, it provides an exceptional value for students, academics and industry researchers.
ICSM 2021: 15. International Conference on Sensor Materials aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Sensor Materials. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Sensor Materials
Call for Contributions
Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Sensor Materials are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.
Guidelines for Authors
Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers. Downloadable versions of the check list for Full-Text Papers and Abstract Papers.
Please refer to the Paper Submission Guideline, Abstract Submission Guideline and Author Information before submitting your paper.
Conference Proceedings
All submitted conference papers will be blind peer reviewed by three competent reviewers. The peer-reviewed conference proceedings are indexed in the Open Science Index, Google Scholar, Semantic Scholar, Zenedo, OpenAIRE, BASE, WorldCAT, Sherpa/RoMEO, and other index databases. Impact Factor Indicators.
Special Journal Issues
ICSM 2021 has teamed up with the Special Journal Issue on Sensor Materials. A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete the Conference Sponsorship Request Form.
Application Forms
Selected Papers
- Sustainable Hydrogel Nanocomposites Based on Grafted Chitosan and Clay for Effective Adsorption of Cationic Dye
H. Ferfera-Harrar, T. Benhalima, D. Lerari - Modeling Engagement with Multimodal Multisensor Data: The Continuous Performance Test as an Objective Tool to Track Flow
Mohammad H. Taheri, David J. Brown, Nasser Sherkat - Design of Wireless and Traceable Sensors for Internally Illuminated Photoreactors
Alexander Sutor, David Demetz - Vision-Based Daily Routine Recognition for Healthcare with Transfer Learning
Bruce X. B. Yu, Yan Liu, Keith C. C. Chan - Thermoplastic Composites with Reduced Discoloration and Enhanced Fire-Retardant Property
Peng Cheng, Liqing Wei, Hongyu Chen, Ruomiao Wang - Current Status and Future Trends of Mechanized Fruit Thinning Devices and Sensor Technology
Marco Lopes, Pedro D. Gaspar, Maria P. Simões - Arduino Pressure Sensor Cushion for Tracking and Improving Sitting Posture
Andrew Hwang - Reinforcing Effects of Natural Micro-Particles on the Dynamic Impact Behaviour of Hybrid Bio-Composites Made of Short Kevlar Fibers Reinforced Thermoplastic Composite Armor
Edison E. Haro, Akindele G. Odeshi, Jerzy A. Szpunar - Machinability Analysis in Drilling Flax Fiber-Reinforced Polylactic Acid Bio-Composite Laminates
Amirhossein Lotfi, Huaizhong Li, Dzung Viet Dao - Electrochemical Response Transductions of Graphenated-Polyaniline Nanosensor for Environmental Anthracene
O. Tovide, N. Jahed, N. Mohammed, C. E. Sunday, H. R. Makelane, R. F. Ajayi, K. M. Molapo, A. Tsegaye, M. Masikini, S. Mailu, A. Baleg, T. Waryo, P. G. Baker, E. I. Iwuoha - Factors Affecting Green Supply Chain Management of Lampang Ceramics Industry
Nattida Wannaruk, Wasawat Nakkiew - The Use of Plant-Based Natural Fibers in Reinforced Cement Composites
N. AlShaya, R. Alhomidan, S. Alromizan, W. Labib - Optimization of Carbon Nanotube Content of Asphalt Nanocomposites with Regard to Resistance to Permanent Deformation
João V. Staub de Melo, Glicério Trichês, Liseane P. Thives - Mechanical, Thermal and Biodegradable Properties of Bioplast-Spruce Green Wood Polymer Composites
A. Atli, K. Candelier, J. Alteyrac - Lightweight and Seamless Distributed Scheme for the Smart Home
Muhammad Mehran Arshad Khan, Chengliang Wang, Zou Minhui, Danyal Badar Soomro
| Rajiv Dutta | Shobhit Deemed University, IN |
| Mitsuhiro Okayasu | Okayama University, JP |
| Hideo Sawada | Hirosaki University, JP |
| Takashi Sakai | Seikei University, JP |
| Yoshimichi Kiyozumi | National Institute of Advanced Industrial Science and Technology, JP |
| ZAKARIA HOSSAIN | Mie University, JP |
| Zakaria Hossain Hossain | Mie University, JP |
| Vu Truong Son Dao | Kinki University, JP |
| Rabindra Prasad Dhakal | University of Miyazaki, JP |
| Hom Dhakal | University of Portsmouth, UK |
| Fawad Inam | Glyndwr University, UK |
| Vijayakumar Sahadevan | Atkins, UK |
| Yin Liu | SCP Limited, US |
| Huachun Zhai | Idaho Asphalt Supply, US |
| Issam Harik | University of Kentucky, US |
| Vivek Kumar | Suffolk County Community College, US |
| Varun Lingaiah Kopparthy | Cleveland Clinic Lerner College of Medicine, US |
| Nimet Yildirim Tirgil | Ankara Yildirim Beyazit University, US |
| Pinar Acar | Virginia Tech, US |
| Lei Mei | Agilent Technologies, US |
| Fanxu Meng | Houston Advanced Research Center (HARC), US |
| Niravkumar Joshi | University of Sao Paulo, US |
| Ehsan Kamrani | Harvard University, US |
| Hamid Torabi | Washington State University, US |
| Vivek Sharma | Intel Corporation, US |
| Khun Nay Win Khun | The Ohio State University, US |
| Hua Tan | Hewlett - Packard Company, US |
| Jing-jiang Yu | Agilent Technologies, Inc., US |
| Cecil Coutinho | University of South Florida, US |
| Xueji Zhang | University of South Floirda, US |
| Abstracts/Full-Text Paper Submission Deadline | January 06, 2020 | |
| Notification of Acceptance/Rejection | January 28, 2020 | |
| Final Paper (Camera Ready) Submission & Early Bird Registration Deadline | March 22, 2021 | |
| Conference Dates | April 22-23, 2021 |
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