您好,欢迎登录Mr.confs会先生官方网站!

ICSMIA 2021: 15. International Conference on Smart Materials and Innovative Applications

时间:2021-06-24 至 2021-06-25

ICSMIA 2021: 15. International Conference on Smart Materials and Innovative Applications
收藏0
ICSMIA 2021: 15. International Conference on Smart Materials and Innovative Applications
会议时间:2021-06-24 至 2021-06-25
会议地点: Paris, France,Paris,France 周边酒店预订

发票类型: 不支持开票
参会凭证:其它

门票信息
Participation Type Early Registration Fees Registration Fees
Non-Student Oral/Poster Presenter Registration € 450 € 500
Student Oral/Poster Presenter Registration € 350 € 400
Listener Registration € 250 € 300
Additional Paper Publication € 100
会议介绍

The International Research Conference Aims and Objectives

The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations. With its high quality, it provides an exceptional value for students, academics and industry researchers.

ICSMIA 2021: 15. International Conference on Smart Materials and Innovative Applications aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Smart Materials and Innovative Applications. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Smart Materials and Innovative Applications

Call for Contributions

Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Smart Materials and Innovative Applications are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.

Guidelines for Authors

Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers. Downloadable versions of the check list for Full-Text Papers and Abstract Papers.

Please refer to the Paper Submission Guideline, Abstract Submission Guideline and Author Information before submitting your paper.

Conference Proceedings

All submitted conference papers will be blind peer reviewed by three competent reviewers. The peer-reviewed conference proceedings are indexed in the Open Science Index, Google Scholar, Semantic Scholar, Zenedo, OpenAIRE, BASE, WorldCAT, Sherpa/RoMEO, and other index databases. Impact Factor Indicators.

Special Journal Issues

ICSMIA 2021 has teamed up with the Special Journal Issue on Smart Materials and Innovative Applications. A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.

Conference Sponsor and Exhibitor Opportunities

The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete the Conference Sponsorship Request Form.

Mohammad Gudarzi University of Pittsburgh, US
Reza Montazami Iowa State University, US
Juntao Fei University of Louisiana, US
Sakthivel S Tata Consulting Engineers Limited, IN
Hanan Jumaa Alhejazi University of British Columbia, Faculty of Applied Science, CA
Suboohi Shervani Memorial University of Newfoundland, CA
Alireza Shooshtari Bu-Ali Sina University, IR
Fahad Al-Mubaddel King Saud University, SA
Amirreza Shayganpour Istituto Italiano di Tecnologia (IIT), IT
Atta Ur Rahman Shanghai Jiao Tong University, CN
Nilanjan Mallik IIT(BHU), IN
Brahim Aissa Hamad Bin Khalifa University,, QA
Subhas Ganguly National Institute of Technology, Raipur, IN
Hamidreza Rostami Amirkabir University of Technology (Tehran Polytechnic), Iran, Islamic Republic Of
Wei Sun University of Nottingham , United Kingdom
Tadeusz Pieczonka AGH University of Science and Technology, Poland
Rinlee Butch Cervera University of the Philippines Diliman, PH
Abdulkadir Cüneyt Aydin Ataturk University, TR
Siti Rabiatull Aisha Binti Idris Aisha Universiti Malaysia Pahang, MY
Sylwia Wiewiorowska Częstochowa University of Technology, PL
Eshwara Prasad Koorapati Jawaharlal Nehru Technological University Hyderabad, IN
Dattaji Shinde Veermata Jijabai Technological Institute, IN
Velaphi Msomi Cape Peninsula University of Technology, ZA
Andy Mathiazhagan Cochin University of Science and Technology, IN
Noor Akhmazillah Mohd Fauzi Universiti Tun Hussein Onn Malaysia, MY
Elmo Cöuras Ford Federal University of Pernambuco (UFPE), BR
Carlos Castro CEFET-MG, BR
Sibele Cestari IMA-UFRJ, BR
Beddiaf Zaidi University of Batna 1, DZ
Muhammad Taqi Zahid Butt University of the Punjab, PK
会议日程
Abstracts/Full-Text Paper Submission Deadline   January 06, 2020
Notification of Acceptance/Rejection   January 28, 2020
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline   May 25, 2021
Conference Dates   June 24-25, 2021
参会指南
会议地点
×