International Conference on Electron Devices and Applications (ICEDA 2021)

The International Conference on Electron Devices and Applications (ICEDA 2021) covers topics such as:

• Logic device performance and circuit design challenges
• CMOS platform technologies
• Process module and process control advancements
• Advanced process integration schemes and scaling approaches
• SiGe/Ge channel, GAA nanowire and stacked nanosheet
• Device technology co-optimization solutions
• BEOL compatible transistors
• Stacked and monolithic 3D integration
• High-speed wafer-level photonic-electronic integration
• Heterogeneous optoelectronic integration (incl. sources, modulators)
• Imagers (high time-resolution, high-sensitivity)
• Organic and inorganic displays
• Large-scale optoelectronic integration for sensors
• Optoelectronic integration for neuromorphic and quantum computing
• Thin film transistors, flexible, stretchable, and printed electronics
• Technology CAD and benchmarking
• VCSEL sensors, microLED, flexible displays
• Physics-based compact model
• Memory and alternative computing device modeling
• Design-oriented modeling: variability, reliability and yield
• Atomistic process and device modeling
• Advanced integration and packaging modeling
• Atomistic-device hybrid modeling at large scale
• Device and interconnect modeling for quantum computing

The International Conference on Electron Devices and Applications (ICEDA 2021) will be held in Nanjing, China on 14-16 Aug 2021.