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ICEDC 2021: 15. International Conference on Electronic Design and Circuits

时间：2021-03-25 至 2021-03-26

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ICEDC 2021: 15. International Conference on Electronic Design and Circuits
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ICEDC 2021: 15. International Conference on Electronic Design and Circuits
会议时间：2021-03-25 至 2021-03-26
会议地点： Madrid, Spain,Madrid,Spain 周边酒店预订

发票类型： 不支持开票
参会凭证：其它

门票信息
Participation Type Early Registration Ticket Fees Registration Ticket Fees
Non-Student Oral/Poster Presenter Registration € 450 € 500
Student Oral/Poster Presenter Registration € 350 € 400
Listener Registration € 250 € 300
Additional Paper Publication € 100
会议介绍

The International Research Conference Aims and Objectives

The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations. With its high quality, it provides an exceptional value for students, academics and industry researchers.

ICEDC 2021: 15. International Conference on Electronic Design and Circuits aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Electronic Design and Circuits. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Electronic Design and Circuits

Call for Contributions

Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Electronic Design and Circuits are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.

Guidelines for Authors

Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers. Downloadable versions of the check list for Full-Text Papers and Abstract Papers.

Please refer to the Paper Submission Guideline, Abstract Submission Guideline and Author Information before submitting your paper.

Conference Proceedings

All submitted conference papers will be blind peer reviewed by three competent reviewers. The peer-reviewed conference proceedings are indexed in the Open Science Index, Google Scholar, Semantic Scholar, Zenedo, OpenAIRE, BASE, WorldCAT, Sherpa/RoMEO, and other index databases. Impact Factor Indicators.

Special Journal Issues

ICEDC 2021 has teamed up with the Special Journal Issue on Electronic Design and Circuits. A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.

Conference Sponsor and Exhibitor Opportunities

The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete the Conference Sponsorship Request Form.

Application Forms

Selected Papers

  1. Self-Healing Phenomenon Evaluation in Cementitious Matrix with Different Water/Cement Ratios and Crack Opening Age
    V. G. Cappellesso, D. M. G. da Silva, J. A. Arndt, N. dos Santos Petry, A. B. Masuero, D. C. C. Dal Molin
  2. Study of a Developed Model Describing a Vacuum Membrane Distillation Unit Coupled to Solar Energy
    Fatma Khaled, Khaoula Hidouri, Bechir Chaouachi
  3. Reversible Binary Arithmetic for Integrated Circuit Design
    D. Krishnaveni, M. Geetha Priya
  4. Separation Characteristics of the Hollow Fiber Membrane Module Using Water Mixed with Small Sized Bubbles Composed of Synthesized Exhalations
    Pil Woo Heo, Hyunse Kim
  5. A 0.9 V, High-Speed, Low-Power Tunable Gain Current Mirror
    Hassan Faraji Baghtash
  6. Formation of Volatile Iodine from Cesium Iodide Aerosols: A DFT Study
    Houssam Hijazi, Laurent Cantrel, Jean-François Paul
  7. Design of a CMOS Differential Operational Transresistance Amplifier in 90 nm CMOS Technology
    Hafiz Muhammad Obaid, Umais Tayyab, Shabbir Majeed Ch.
  8. Design and Implementation of Embedded FM Transmission Control SW for Low Power Battery System
    Young-Su Ryu, Kyung-Won Park, Jae-Hoon Song, Ki-Won Kwon
  9. Low Power Consuming Electromagnetic Actuators for Pulsed Pilot Stages
    M. Honarpardaz, Z. Zhang, J. Derkx, A. Trangärd, J. Larsson
  10. Design and Analysis of 1.4 MW Hybrid Saps System for Rural Electrification in Off-Grid Applications
    Arpan Dwivedi, Yogesh Pahariya
  11. Reversible Signed Division for Computing Systems
    D. Krishnaveni, M. Geetha Priya
  12. O-Functionalized CNT Mediated CO Hydro-Deoxygenation and Chain Growth
    K. Mondal, S. Talapatra, M. Terrones, S. Pokhrel, C. Frizzel, B. Sumpter, V. Meunier, A. L. Elias
  13. Learning Algorithms for Fuzzy Inference Systems Composed of Double- and Single-Input Rule Modules
    Hirofumi Miyajima, Kazuya Kishida, Noritaka Shigei, Hiromi Miyajima
  14. The Development of an Integrity Cultivating Module in School-Based Assessment among Malaysian Teachers: A Research Methodology
    Eftah Bte. Moh Hj Abdullah, Abd Aziz Bin Abd Shukor, Norazilawati Binti Abdullah, Rahimah Adam, Othman Bin Lebar
  15. Wireless Power Transfer Application in GSM Controlled Robot for Home Automation
    Kaibalya Prasad Panda, Nirakar Behera, Kamal Lochan Biswal
Gianluca Cornetta Universidad San Pablo-CEU, ES
Pragya Kushwaha University of California Berkeley USA, US
Ashok Goel Michigan Technological University, US
Joseph Prabhakar Williams Sri Indu College of Engineering and Technology, IN
Nalini Iyer KLE Technological University, IN
Kashan Bashir Tsinghua University , CN
Julie Borah Indian Institute of Technology Delhi, IN
Aravind Kumar Madam GVVR Institute of Technology, IN
Himani Mittal R.K.G.I.T, GHAZIABAD, IN
Rana Mukherji The ICFAI University Jaipur, IN
Kalamani C Mahalingam College of Engineering and Technology, IN
Ananth Kumar T IFET College of Engineering, IN
Yedukondalu Udara Jawaharlal Nehru Technological University, Kakinada, IN
Cherry Bhargava Lovely Professional University, IN
Nikhil Raj NIT Kurukshetra, IN
Soumya J Birla Institute of Technology and Science-Pilani, Hyderabad Campus, IN
Rajeswaran Nagalingam Malla Reddy Engineering College, IN
Manoj Kumar Patel National Institute of Technology Nagaland, IN
Vithyalakshmi N Sree Vidyanikethan Engineering College, IN
A. Shirly Edward SRM University, IN
Paramasivam K Kumaraguru College of Technology, IN
Ashokkumar Nagarajan Anna University, IN
Vaibhav Neema Electronics and Telecommunication Engineering Department, IN
Nuridayanti Che Khalib Universiti Sains Malaysia, Malaysia
Alpesh Adeshara R.K. University, India
Nikita Matveev Moscow State University of Civil Engineering, Russian Federation
Pejman Hosseiniun Sama Technical and Vocational Training College, Islamic Azad University, Iran, Islamic Republic Of
Edward Guillen Military University Nueva Granada, Colombia
Amairullah Khan Lodhi Shadan College of Engineering and Technology, IN
Lili Chen Qingdao University of Science and Technology, China
会议日程
Abstracts/Full-Text Paper Submission Deadline   February 15, 2021
Notification of Acceptance/Rejection   March 01, 2021
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline   February 26, 2021
Conference Dates   March 25-26, 2021
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