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ICPEIMT 2021: 15. International Conference on Power Electronics Integration and Manufacturing Technologies

时间:2021-05-17 至 2021-05-18

ICPEIMT 2021: 15. International Conference on Power Electronics Integration and Manufacturing Technologies
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ICPEIMT 2021: 15. International Conference on Power Electronics Integration and Manufacturing Technologies
会议时间:2021-05-17 至 2021-05-18
会议地点: Paris, France,Paris,France 周边酒店预订

发票类型: 不支持开票
参会凭证:其它

门票信息
Participation Type Early Registration Ticket Fees Registration Ticket Fees
Non-Student Oral/Poster Presenter Registration € 450 € 500
Student Oral/Poster Presenter Registration € 350 € 400
Listener Registration € 250 € 300
Additional Paper Publication € 100
会议介绍

The International Research Conference Aims and Objectives

The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations. With its high quality, it provides an exceptional value for students, academics and industry researchers.

ICPEIMT 2021: 15. International Conference on Power Electronics Integration and Manufacturing Technologies aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Power Electronics Integration and Manufacturing Technologies. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Power Electronics Integration and Manufacturing Technologies

Call for Contributions

Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Power Electronics Integration and Manufacturing Technologies are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.

Guidelines for Authors

Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers. Downloadable versions of the check list for Full-Text Papers and Abstract Papers.

Please refer to the Paper Submission Guideline, Abstract Submission Guideline and Author Information before submitting your paper.

Conference Proceedings

All submitted conference papers will be blind peer reviewed by three competent reviewers. The peer-reviewed conference proceedings are indexed in the Open Science Index, Google Scholar, Semantic Scholar, Zenedo, OpenAIRE, BASE, WorldCAT, Sherpa/RoMEO, and other index databases. Impact Factor Indicators.

Special Journal Issues

ICPEIMT 2021 has teamed up with the Special Journal Issue on Power Electronics Integration and Manufacturing Technologies. A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.

Conference Sponsor and Exhibitor Opportunities

The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete the Conference Sponsorship Request Form.

Selected Papers

  1. An Evaluation on the Effectiveness of a 3D Printed Composite Compression Mold
    Peng Hao Wang, Garam Kim, Ronald Sterkenburg
  2. Evaluation of Environmental, Technical, and Economic Indicators of a Fused Deposition Modeling Process
    M. Yosofi, S. Ezeddini, A. Ollivier, V. Lavaste, C. Mayousse
  3. Influence of Selected Finishing Technologies on the Roughness Parameters of Stainless Steel Manufactured by Selective Laser Melting Method
    J. Hajnys, M. Pagac, J. Petru, P. Stefek, J. Mesicek, J. Kratochvil
  4. Numerical Simulation on Deformation Behaviour of Additively Manufactured AlSi10Mg Alloy
    Racholsan Raj Nirmal, B. S. V. Patnaik, R. Jayaganthan
  5. Effects of Milling Process Parameters on Cutting Forces and Surface Roughness When Finishing Ti6al4v Produced by Electron Beam Melting
    Abdulmajeed Dabwan, Saqib Anwar, Ali Al-Samhan
  6. Characterization of a Hypoeutectic Al Alloy Obtained by Selective Laser Melting
    Jairo A. Muñoz, Alexander Komissarov, Alexander Gromov
  7. Metal Inert Gas Welding-Based-Shaped Metal Deposition in Additive Layered Manufacturing: A Review
    Adnan A. Ugla, Hassan J. Khaudair, Ahmed R. J. Almusawi
  8. Design for Metal Additive Manufacturing: An Investigation of Key Design Application on Electron Beam Melting
    Wadea Ameen, Abdulrahman Al-Ahmari, Osama Abdulhameed
  9. Investigating the Effectiveness of a 3D Printed Composite Mold
    Peng Hao Wang, Garam Kim, Ronald Sterkenburg
  10. Tensile Properties of 3D Printed PLA under Unidirectional and Bidirectional Raster Angle: A Comparative Study
    Shilpesh R. Rajpurohit, Harshit K. Dave
  11. Optimization of Surface Roughness in Additive Manufacturing Processes via Taguchi Methodology
    Anjian Chen, Joseph C. Chen
  12. FEM Simulations to Study the Effects of Laser Power and Scan Speed on Molten Pool Size in Additive Manufacturing
    Yee-Ting Lee, Jyun-Rong Zhuang, Wen-Hsin Hsieh, An-Shik Yang
  13. Material and Parameter Analysis of the PolyJet Process for Mold Making Using Design of Experiments
    A. Kampker, K. Kreisköther, C. Reinders
  14. Fiber-Reinforced Sandwich Structures Based on Selective Laser Sintering: A Technological View
    T. Häfele, J. Kaspar, M. Vielhaber, W. Calles, J. Griebsch
  15. Influence of Build Orientation on Machinability of Selective Laser Melted Titanium Alloy-Ti-6Al-4V
    Manikandakumar Shunmugavel, Ashwin Polishetty, Moshe Goldberg, Junior Nomani, Guy Littlefair
Olivier Kerbrat ENS Cachan, FR
Oana Ghita Exeter Advanced Technologies, UK
Michael Kassner University of Southern California, US
Bo Jin Air Products, US
Dean Bartles National Center for Defense Manufacturing and Machining, US
Keivan Davami University of Alabama, US
Vardhini Catari Catari Taylor Business Institute, US
Joseph Prabhakar Williams Sri Indu College of Engineering and Technology, IN
Nzar Naqeshbandi University of Minho, PT
Amer Shebani Zawiya College of Computer, LY
Nelidya Md Yusoff University of Technology, Malaysia, MY
Marios Kazasidis Trinity College Dublin, IE
Aamer Nazir National Taiwan University of Science and Technology, TW
Edgar Andres Parra Ricaurte Technical University of Madrid, ES
Sima Valizadeh Sandbacka Science Park, SE
Muralimohan Cheepu Pukyong National University, KR
Shailendra Kumar S.V. National Institute of Technology, Surat, IN
Wadea Ameen King Saud University, SA
Armin Moniri Canmet ENERGY Devon, Natural Resources Canada, CA
Rajkumar Velu Singapore University of Technology and Design, SG
Olawale Samuel Fatoba University of Johannesburg, ZA
Elnaz Asadollahiyazdi University of Technology of Troyes, France
Jeremy Faludi University of California Berkeley, United States
Marco Regis Limacorporate, Italy
Waheb Abdullah University Malaysia Pahang, MY
Katarzyna Mleczko Silesian University of Technology, Poland
Yasusi Kanada Dasyn.com, Japan
M J Tsai National Taiwan University of Science and Technology, Taiwan
Ahmad Forouzan Tabar Islamic Azad University, Marvdasht Branch, Iran, Islamic Republic Of
Adnan Ugla University of Thi-Qar, IQ
会议日程
Abstracts/Full-Text Paper Submission Deadline   April 01, 2021
Notification of Acceptance/Rejection   April 15, 2021
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline   April 16, 2021
Conference Dates   May 17-18, 2021
参会指南
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