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ICRAMECE 2021: 15. International Conference on Recent Advances in Mechanical, Electronics and Computer Engineering

时间：2021-07-19 至 2021-07-20

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ICRAMECE 2021: 15. International Conference on Recent Advances in Mechanical, Electronics and Computer Engineering
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ICRAMECE 2021: 15. International Conference on Recent Advances in Mechanical, Electronics and Computer Engineering
会议时间：2021-07-19 至 2021-07-20
会议地点： Paris, France,Paris,France 周边酒店预订

发票类型： 不支持开票
参会凭证：其它

门票信息
Participation Type Early Registration Ticket Fees Registration Ticket Fees
Non-Student Oral/Poster Presenter Registration € 450 € 500
Student Oral/Poster Presenter Registration € 350 € 400
Listener Registration € 250 € 300
Additional Paper Publication € 100
会议介绍

The International Research Conference Aims and Objectives

The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations. With its high quality, it provides an exceptional value for students, academics and industry researchers.

ICRAMECE 2021: 15. International Conference on Recent Advances in Mechanical, Electronics and Computer Engineering aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Recent Advances in Mechanical, Electronics and Computer Engineering. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Recent Advances in Mechanical, Electronics and Computer Engineering

Call for Contributions

Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Recent Advances in Mechanical, Electronics and Computer Engineering are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.

Guidelines for Authors

Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers. Downloadable versions of the check list for Full-Text Papers and Abstract Papers.

Please refer to the Paper Submission Guideline, Abstract Submission Guideline and Author Information before submitting your paper.

Conference Proceedings

All submitted conference papers will be blind peer reviewed by three competent reviewers. The peer-reviewed conference proceedings are indexed in the Open Science Index, Google Scholar, Semantic Scholar, Zenedo, OpenAIRE, BASE, WorldCAT, Sherpa/RoMEO, and other index databases. Impact Factor Indicators.

Special Journal Issues

ICRAMECE 2021 has teamed up with the Special Journal Issue on Recent Advances in Mechanical, Electronics and Computer Engineering. A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.

Conference Sponsor and Exhibitor Opportunities

The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete the Conference Sponsorship Request Form.

Application Forms

Selected Papers

  1. Bearing Behavior of a Hybrid Monopile Foundation for Offshore Wind Turbines
    Zicheng Wang
  2. Real-Time Episodic Memory Construction for Optimal Action Selection in Cognitive Robotics
    Deon de Jager, Yahya Zweiri, Dimitrios Makris
  3. Evaluation of Underground Water Flow into Tabriz Metro Tunnel First Line by Hydro-Mechanical Coupling Analysis
    L. Nikakhtar, S. Zare
  4. Robotic Assistance in Nursing Care: Survey on Challenges and Scenarios
    Pascal Gliesche, Kathrin Seibert, Christian Kowalski, Dominik Domhoff, Max Pfingsthorn, Karin Wolf-Ostermann, Andreas Hein
  5. Design of Stainless Steel Implant for Fractured Distal Femur
    Abhishek Soni, Bhagat Singh
  6. Modeling of Titanium Alloy Implant for Fractured Distal Femur
    Abhishek Soni, Bhagat Singh
  7. Modeling of Cobalt-Chromium-Molybdenum Alloy Implant for Fractured Distal Femur
    Abhishek Soni, Bhagat Singh
  8. The Design of a Die for the Processing of Aluminum through Equal Channel Angular Pressing
    P. G. F. Siqueira, N. G. S. Almeida, P. M. A. Stemler, P. R. Cetlin, M. T. P. Aguilar
  9. Effects of School Facilities’ Mechanical and Plumbing Characteristics and Conditions on Student Attendance, Academic Performance and Health
    Erica Cochran Hameen, Bobuchi Ken-Opurum, Shalini Priyadarshini, Berangere Lartigue, Sadhana Anath-Pisipati
  10. Principle Knowledge of Integrated Pest Management Adopting Cotton Cultivators in Irrigated and Rainfed Conditions: A Critical Analysis
    B. Sudhakar, K. A. Ponnusamy
  11. Effect of Heat Treatment on Mechanical Properties and Wear Behavior of Al7075 Alloy Reinforced with Beryl and Graphene Hybrid Metal Matrix Composites
    Shanawaz Patil, Mohamed Haneef, K. S. Narayanaswamy
  12. Effectiveness Evaluation of a Machine Design Process Based on the Computation of the Specific Output
    Barenten Suciu
  13. Mechanical Properties of Powder Metallurgy Processed Biodegradable Zn-Based Alloy for Biomedical Application
    Maruf Yinka Kolawole, Jacob Olayiwola Aweda, Farasat Iqbal, Asif Ali, Sulaiman Abdulkareem
  14. Valorization of the Algerian Plaster and Dune Sand in the Building Sector
    S. Dorbani, F. Kharchi, F. Salem, K. Arroudj, N. Chioukh
  15. Producing and Mechanical Testing of Urea-Formaldehyde Resin Foams Reinforced by Waste Phosphogypsum
    Krasimira Georgieva, Yordan Denev
Rajiv Dutta Shobhit University, IN
Bharatiraja Chokkalingam SRM Institute of Science and Technology, IN
Simon Tamayo Giraldo Mines ParisTech, FR
Vigen Arakelyan National Institute of Applied Sciences of Rennes, FR
CHIROUF FARID University of Caen, FR
Gang YANG SUPELEC, FR
Ezendu Ariwa University of Bedfordshire, UK
Mohammad Al - Amri University of Surrey, UK
Bhaskar Choubey University of Glasgow, UK
Ka Sing Lim University of Liverpool, UK
Ricardo Cruz John Crane UK, UK
Behnam Ahmadikia University of California, Santa Barbara, US
Fulvio Siciliano Dynamic Systems Inc., US
Ceci Morales Carnegie Mellon University, US
Khaled Elbehiery DeVry University, US
Pouria Karimi Shahri University of North Carolina at Charlotte, US
Chung Hyun Goh University of Texas at Tyler, US
Mohammad Khatibi University of Texas at San Antonio, US
Arash Mahyari Florida Institute For Human and Machine Cognition, US
Pragya Kushwaha University of California Berkeley USA, US
Kartik Iyer University of Minnesota, US
Ephraim Suhir Portland State University, US
Marcos Paul Gerardo Castro Ford Greenfield Labs, US
Keivan Davami University of Alabama, US
Florian Misoc Kennesaw State University, US
Omid Saber Texas A&M University, US
Mohammad Reza Zamani Kouhpanji University of Minnesota Twin Cities, US
P. S. Jagadeesh Kumar Harvard University, Cambridge, United States, US
Albert Alexander Stonier Northeastern University, US
Ehsan Kamrani Harvard University, US
会议日程
Abstracts/Full-Text Paper Submission Deadline   April 01, 2021
Notification of Acceptance/Rejection   April 15, 2021
Final Paper (Camera Ready) Submission & Early Bird Registration Deadline   June 19, 2021
Conference Dates   July 19-20, 2021
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