ICEAS 2021: 15. International Conference on Electronic Adhesives and Sealants
- 会议时间：2021-09-20 至 2021-09-21
- 会议地点： Paris, France,Baku,Azerbaijan 周边酒店预订
发票类型：
不支持开票
参会凭证：其它
| Participation Type | Early Registration Ticket Fees | Registration Ticket Fees |
|---|---|---|
| Non-Student Oral/Poster Presenter Registration | € 450 | € 500 |
| Student Oral/Poster Presenter Registration | € 350 | € 400 |
| Listener Registration | € 250 | € 300 |
| Additional Paper Publication | € 100 | |
The International Research Conference Aims and Objectives
The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations. With its high quality, it provides an exceptional value for students, academics and industry researchers.
ICEAS 2021: 15. International Conference on Electronic Adhesives and Sealants aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Electronic Adhesives and Sealants. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Electronic Adhesives and Sealants
Call for Contributions
Prospective authors are kindly encouraged to contribute to and help shape the conference through submissions of their research abstracts, papers and e-posters. Also, high quality research contributions describing original and unpublished results of conceptual, constructive, empirical, experimental, or theoretical work in all areas of Electronic Adhesives and Sealants are cordially invited for presentation at the conference. The conference solicits contributions of abstracts, papers and e-posters that address themes and topics of the conference, including figures, tables and references of novel research materials.
Guidelines for Authors
Please ensure your submission meets the conference's strict guidelines for accepting scholarly papers. Downloadable versions of the check list for Full-Text Papers and Abstract Papers.
Please refer to the Paper Submission Guideline, Abstract Submission Guideline and Author Information before submitting your paper.
Conference Proceedings
All submitted conference papers will be blind peer reviewed by three competent reviewers. The peer-reviewed conference proceedings are indexed in the Open Science Index, Google Scholar, Semantic Scholar, Zenedo, OpenAIRE, BASE, WorldCAT, Sherpa/RoMEO, and other index databases. Impact Factor Indicators.
Special Journal Issues
ICEAS 2021 has teamed up with the Special Journal Issue on Electronic Adhesives and Sealants. A number of selected high-impact full text papers will also be considered for the special journal issues. All submitted papers will have the opportunity to be considered for this Special Journal Issue. The paper selection will be carried out during the peer review process as well as at the conference presentation stage. Submitted papers must not be under consideration by any other journal or publication. The final decision for paper selection will be made based on peer review reports by the Guest Editors and the Editor-in-Chief jointly. Selected full-text papers will be published online free of charge.
Conference Sponsor and Exhibitor Opportunities
The Conference offers the opportunity to become a conference sponsor or exhibitor. To participate as a sponsor or exhibitor, please download and complete the Conference Sponsorship Request Form.
Application Forms
Selected Papers
- Impact of Welding Wire Nickel Plating Process Parameters on Ni Layer Thickness
Sylwia Wiewiorowska, Zbigniew Muskalski - Evaluating Mechanical Properties of CoNiCrAlY Coating from Miniature Specimen Testing at Elevated Temperature
W. Wen, G. Jackson, S. Maskill, D. G. McCartney, W. Sun - Experimental Investigation on the Effects of Electroless Nickel Phosphorus Deposition, pH and Temperature with the Varying Coating Bath Parameters on Impact Energy by Taguchi Method
D. Kari Basavaraja, M. G. Skanda, C. Soumya, V. Ramesh - Evaluation of the Elastic Mechanical Properties of a Hybrid Adhesive Material
Moudar H. A. Zgoul, Amin Al Zamer - Investigation into Black Oxide Coating of 410 Grade Surgical Stainless Steel Using Alkaline Bath Treatment
K. K. Saju, A. R. Reghuraj - Investigation of VN/TiN Multilayer Coatings on AZ91D Mg Alloys
M. Ertas, A. C. Onel, G. Ekinci, B. Toydemir, S. Durdu, M. Usta, L. Colakerol Arslan - Mechanical and Chemical Properties of Zn-Ni-Al2O3 Nanocomposite Coatings
Soroor Ghaziof, Wei Gao - The Effects of Increasing Unsaturation in Palm Oil and Incorporation of Carbon Nanotubes on Resinous Properties
Muhammad R. Islam, Mohammad Dalour H. Beg, Saidatul S. Jamari - Synthesizing CuFe2O4 Spinel Powders by a Combustion-Like Process for Solid Oxide Fuel Cell Interconnect Coatings
S. N. Hosseini, M. H. Enayati, F. Karimzadeh, N. M. Sammes - Production and Characterization of Sol-Enhanced Zn- Ni-Al2O3 Nanocomposite Coating
Soroor Ghaziof, Wei Gao - Nanoindentation of Thin Films Prepared by Physical Vapor Deposition
Dhiflaoui Hafedh, Khlifi Kaouthar, Ben Cheikh Larbi Ahmed - Development and Characterization of Bio-Tribological, Nano-Multilayer Coatings for Medical Tools Application
L. Major, J. M. Lackner, M. Dyner, B. Major - Hemocompatible Thin-Film Materials Recreating the Structure of the Cell Niches with High Potential for Endothelialization
Roman Major, Klaudia Trembecka-Wojciga, Juergen Markus Lackner, Boguslaw Major - Environmental Friendly Polyurethane Coatings Based On Hyperbranched Resin
Ashraf M. Elsaid, Magd M. Badr, Mohamed S. Selim - Influence of Different Mixing Ratios of Adhesives for Wood Bondline Quality
Jan Vanerek, Anna Benesova, Pavel Rovnanik
| ARAB TEHRANI Kambiz | University of Nancy, FR |
| Hashini Mohottala | University of Hartford, US |
| Khun Nay Win Khun | The Ohio State University, US |
| Safia Lemlikchi | Center for Development of Advanced Technologies , DZ |
| Tiegang Wang | Tianjin University of Education and Technology, CN |
| Sunita Mohapatra | Raychem RPG PVT LTD, IN |
| Gurbhinder Singh Brar | Guru Kashi University, IN |
| Saeed Nouri | Iran University of Science and Technology, IR |
| Agnieszka Sobczk-Kupiec | Cracow University of Technology, Institute of Inorganic Chemistry and Technology, PL |
| Abhilasha Mishra | Rani Durgavati University Jabalpur, IN |
| Adriana Stefan | National Institute for Aerospace Research Elie Carafoli, RO |
| Jayashree Bijwe | INDIAN INSTITUTE OF TECHNOLOGY, IN |
| Sukhminderbir Singh Kalsi | IKG Punjab Technical University, IN |
| Seyedeh Narjes Hosseini | Isfahan University of Technology, Iran, Islamic Republic Of |
| Soroor Ghaziof | The University of Auckland, New Zealand |
| Roman Major | Institute of Metallurgy and Materials Science Polish Academy of Sciences, Poland |
| Lukasz Major | Institute of Metallurgy and Materials Science Polish Academy of Sciences, Poland |
| K. K. Saju | Cochin University of Science and Technology, India |
| Dharmaprakash M S | BMS College of Engineering, IN |
| Aditya Kumar | National Institute of Technology, Rourkela, IN |
| Halil Caliskan | Bartin University, TR |
| Sergey Seriy | Institute of Matherial Science, RU |
| Ferhat Bülbül | Ataturk University, TR |
| Muhammad Umar Manzoor | University of the Punjab, PK |
| Uma Maheshwera Reddy Paturi | CVR College of Engineering , IN |
| Rong Liu | Carleton University, CA |
| Mehdi Khodaei | K. N. Toosi University of Technology, IR |
| Ali Mohammed | Technical Institute of Shatrah, IQ |
| Salim Hassani | Center for Development of Advanced Technologies, DZ |
| Haidy Atef Abass Haidy | German University in cairo, EG |
| Abstracts/Full-Text Paper Submission Deadline | April 01, 2021 | |
| Notification of Acceptance/Rejection | April 15, 2021 | |
| Final Paper (Camera Ready) Submission & Early Bird Registration Deadline | August 19, 2021 | |
| Conference Dates | September 20-21, 2021 |
